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Troubleshooting and defect analyses of components embedded within opaque resins are described, on both individual components and complete circuit boards. Quantitative analysis to the ppm level is ideally suited for ensuring compliance to the WEEE/RoHS directives.
Analysis of resin embedded chip (A) optical image, 100x magnification, (B) transmitted x-ray image and (C) composite XRF image (Au + Ni + Sn).
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