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Fully Automated Thin Film Inspection System Brochure
Xtrology
Fully Automated Thin Film Inspection System
Combines multiple sensors and automation technology to provide increased value for semiconductor wafer inspection
The new product, "Xtrology," Fully Automated Thin Film Inspection System*1 has made it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
In recent years, the number of inspection items in the manufacturing process has increased due to technological advances in the semiconductor industry, and the level of inspection requirements continues to rise.
Xtrology conducts the inspection and defect reviews on a wide range of wafer sizes and materials used in legacy and cutting-edge processes for silicon and compound semiconductor-based devices.
We offer a variety of solutions by integrating a variety of sensors and automation technologies developed independently based on HORIBA's core technology into one platform.
1. Customization of sensors and specifications for customers’ inspection needs
"Xtrology," is a highly customizable system that allows you to select one or multiple sensors from three analysis methods: spectroscopic ellipsometry*2, Raman spectroscopy*3, and photoluminescence*4. This has made it possible to perform important inspections of various wafers with a single instrument.
■Main measurement solutions
| Film Thickness | Measurement of film thickness and film quality, single or multiple layers analysis |
| Optical Properties | Measurement of n (light refractive index), k (extinction coefficient*5), and Eg (bandgap*6) |
| Crystallinity | Uniformity assessment of the material crystal structure, etc. |
| Composition / Stoichiometry | Analysis of material ingredients and content, and uniformity assessment |
| Defects Inspection | Defect location, classification, and particle inspection and identification |
| Stress | Stress*7 uniformity evaluation |
■Available sensor examples
| Spectroscopic ellipsometer | Raman microscope | Photoluminescence |
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2. Automatic measurement technology contributes to improved efficiency and yield
It not only has an automation function that combines our in-house developed automatic conveyance system and non-destructive, non-contact sensors, but also connects multiple external devices, such as open cassettes*8, SMIF*9, and FOUP*10. Continuous measurements can be performed, contributing to more efficient inspection processes and higher yields.
3. Consistent support system because of in-house development
Because HORIBA has developed all of the sensors, automation technology, and software installed in this device in-house, we are able to provide consistent services and maintenance. Having 29 countries and regions around the world in operations, HORIBA provides long-term global support.
*1 The appearance will vary depending on the number, type, and specifications of the sensors installed. (The picture is 2 different sensors installed with multi-ports)
*2 An analysis method that determines the thickness and properties of a sample by measuring changes in the vibrations of light incident on the sample and reflected light
*3 An analysis method that evaluates molecular structure and properties by irradiating a sample with light and detecting the scattered light
*4 An analytical method that obtains information on defects and impurities by absorbing light at a specific wavelength and measuring the light (fluorescence) emitted by the sample
*5 An indicator of how weak light becomes when passing through a substance
*6 Width of region where electrons cannot exist
*7 The force that occurs inside an object when it receives a force from the outside
*8 Open storage pod used when high cleanliness is not required
*9 Abbreviation for Standard Mechanical Interface. Closed storage pod used to transport wafers in semiconductor manufacturing
*10 Abbreviation for Front Opening Unified Pod. Storage pod used to transport and load 300mm wafers into the equipment